Imec, EVG Achieve 200nm Hybrid Bonding, Record Overlay
Imec and EV Group achieve 200nm hybrid bonding pitch with record sub-40nm overlay accuracy, advancing 3D chip integration for CMOS 2.0 architectures.
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France Completes Europe’s Largest 3D Printed Apartment Block
France's ViliaSprint² project in Bezannes delivers Europe's largest 3D printed apartment building with 12 units across 800 square meters, finishing early.
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Porous Glass Breakthrough Traps CO2 and Hydrogen for Industry
Researchers develop processable porous glass that traps CO2 and hydrogen using sodium and lithium compounds inspired by traditional glassmaking techniques.
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AI Model Exposes Hidden Magnetic Energy Loss in EV Motors
Japanese researchers develop AI-driven model exposing hidden magnetic energy losses in electric motors, enabling improved efficiency for EVs.
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Stellantis Expands Qualcomm Partnership for AI Vehicles
Stellantis expands Qualcomm partnership to integrate Snapdragon Digital Chassis SoCs with STLA Brain platform for AI-powered vehicle systems.
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Siemens Acquires Altair Engineering for $10.6 Billion
Siemens completes $10.6B Altair acquisition, merging simulation software with automation platforms to create integrated design-to-manufacturing ecosystem.
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Critical Flaws Found in Industrial Control System Protocols
Security researchers discover critical vulnerabilities in industrial control system protocols affecting manufacturing, utilities, and critical infrastructure.
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