Muse, True Circuits Launch Low-Cost PLL IP for Universities
Muse Semiconductor and True Circuits launch university PLL IP access program with discounted pricing for TSMC 180nm to 16nm processes via MPW services.
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AI Compresses Code Jobs as Space Builds Physical Economy
AI generates 50% of code as software jobs drop 73% for entry-level roles. Meanwhile, space-grown semiconductors with 1000x fewer defects signal shift to physical economy.
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Procurement Budgets Fix OT Supply Chain Cybersecurity
S4x26 showed how 7.5% retainage and FAT/SAT testing deliver 25:1 ROI on OT cybersecurity by shifting vendor accountability before purchase orders.
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MIT Leads 6 DOE Genesis Mission AI Research Projects
DOE selected 278 Genesis Mission projects from 5,000 applications. MIT leads 6 AI-driven research efforts in fusion, quantum sensing, and rare earth separation.
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Technology Reshapes Recreational Boating: Electric, AI, IoT
Electric propulsion hits $4.4B in 2026 as AI collision systems and IoT sensors reshape recreational boating with lower costs and automated safety.
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Intel Foundry Revenue Jumps 32%, But External Wins Lag
Intel Foundry Q2 revenue jumped 32% to $5.8B, but external customers like Fortinet remain scarce against TSMC's 72% market dominance.
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Graduate Student’s NASA Robot Algorithm Solves Assembly Issue
Graduate student Sarah Downs built a force-based robot for NASA that inserts satellite antennas without cameras, solving peg-in-hole assembly in space.
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Chip Industry Week: High-NA EUV, Silicon Photonics, HBM4
Intel ships High-NA EUV Panther Lake processors, UMC delivers first silicon photonics wafers, JEDEC releases SPHBM4 standard for organic substrates.
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PLATON Camera Tracks Invisible Particles Using Light-Field AI
ETH Zurich's PLATON detector uses light-field cameras and AI to track particles in 3D, replacing millions of components with a single scintillator block.
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Electric Field Boosts Ceramic Heat Flow 300%
ORNL researchers tripled ceramic thermal conductivity using electric fields—a 300% gain that could enable switchable cooling in AI chips and power electronics.
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