ASML, Xanadu Partner on Lithography for Quantum Photonics
Xanadu and ASML partner to reduce line edge roughness in photonic quantum chips, targeting optical losses that block fault-tolerant computing.
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USB Standards Incompatibility Challenges Chip Designers
USB-C ports deliver vastly different power and data rates. Cadence explains why identical connectors create compatibility gaps in 2026.
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Australia Turns to 3D Printing for Industrial Sovereignty
Australia's ASPI report introduces "sovereignty countdown" metric for supply chain resilience, backed by military trials of SPEE3D metal 3D printing.
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Industrial Cybersecurity Threats for 2026: What Changed
Four OT threats from S4x26 reshape industrial security: harmonic swarm attacks, hardware trojans, lifecycle management gaps, and EU CRA penalties up to €15M.
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MIT Manufacturing Initiative Draws 800 to First Anniversary
MIT's Initiative for New Manufacturing drew 800 attendees in its first year, added First Solar as eighth member, and funded 8 AI research projects.
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How Liquid Cooling Drives Marathon-Winning Humanoid Robots
Honor Lightning robot's 50-minute half-marathon reveals how liquid cooling and gear optimization enable sustained high-performance in humanoid robots.
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Vibration-Controlled Materials Switch States in Seconds
Staple-shaped particles create materials that switch between strong and flexible states using vibration alone, enabling recyclable structures.
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